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Huawei chip manufacturing and advanced packaging industry chain dashboard

Focus on hybrid bonding, TSV, F2F, 2.5D/3D, DoB, packaging substrates, packaging materials, packaging and testing equipment. The main table only displays listed companies; the color indicates the depth of integration with Huawei/HiSilicon/Huawei storage chain based on public information, and does not represent undisclosed contracts or revenue proportions.

生成：2026-08-14T18:30:34
走势窗口：2023-08-14 至 2026-08-14
31Number of listed companies covered
—Deep fusion/high correlation
—Packaging and testing and packaging body
—PE(TTM) median
—2026E PE median
Deep integration High correlation Medium to high related indirect correlation
company link Technology tags Huawei integration depth Business introduction Fusion basis Current price PE(TTM) Forward PE Market value 3-year rise and fall Price trend in the past three years information
There are no matching companies.

Meter reading caliber

Fusion depth:5=Open direct cooperation/important customer relationships; 4=Historical direct or strong correlation with industry reports; 3=Key domestic equipment/materials/testing links but direct disclosure is limited; 2=Upstream indirect benefits; 1=Observation. Sensitive customer relationships are usually not disclosed continuously, so this is more of a "public evidence + technical slot".

PE：The current PE uses Oriental Fortune Quote PE (TTM). For forward PE, Oriental Fortune F10 consensus expected 2026E PE will be used first; if missing, current price/2026E EPS will be used as a bottom line; if there is no consistent expectation, it will be displayed as empty.

Trend:The three-year price uses the pre-rights restoration daily line of Oriental Fortune. The polyline on the page is a mini trend chart after sampling, and the numerical calculation is still based on the full crawl results.

Unlisted key nodes

    Source and reproducibility